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孔深(Hole depth):80um

电镀厚度 (Copper surface  thickness):15um

电流密度(Current density):2.5ASD


75um盲孔孔径(Blind hole diameter) 

 100um盲孔孔径(Blind hole diameter)




A/R: 4:1       TP: 85%


A/R: 5:1       TP: 70%




SBF-500系列优势(SBF-500 series advantages):


Copper etching is unnecessary due to thin copper surface plated(10 to 15um).


High current density will shorten plating time and improve productivity.

3. 副产物低,药水稳定性高,定期进行活性碳处理即可维持长期性能稳定

Low by-product, highly stable bath and long-time stable performance realized by regular activated carbon treatment.

4. 适用于闪镀和无需闪镀流程

Applicable to flash and no flash process.


Additive agents can be analyzed by CVS.

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