孔深(Hole depth)：80um
电镀厚度 (Copper surface thickness)：15um
电流密度(Current density)：2.5ASD
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75um盲孔孔径(Blind hole diameter) |
100um盲孔孔径(Blind hole diameter) |
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A/R: 4:1 TP: 85% |
A/R: 5:1 TP: 70% |
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SBF-500系列优势（SBF-500 series advantages）:
1.超薄面铜（10-15um低电镀厚度），不需要额外减铜
Copper etching is unnecessary due to thin copper surface plated(10 to 15um).
2超大电流密度可缩短电镀时间，并提高生产效率
High current density will shorten plating time and improve productivity.
3. 副产物低，药水稳定性高，定期进行活性碳处理即可维持长期性能稳定
Low by-product, highly stable bath and long-time stable performance realized by regular activated carbon treatment.
4. 适用于闪镀和无需闪镀流程
Applicable to flash and no flash process.
5.各添加剂均可CVS分析
Additive agents can be analyzed by CVS.
