SBF-510软板填孔药水
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孔径(Blind hole diameter)：65um 电镀厚度 (Copper surface thickness)：8um |
孔深(Hole depth)：25um 电流密度(Current density)：1.5ASD |
SBF-510系列优势(SBF-510 series advantages):
1.超薄面铜、5-10um镀铜厚度即可完成盲孔填孔
Super thin copper plated, blind hole can be filled well when copper thickness plated from 5um to 10um.
2.副产物低、干膜抗污染性强、药水稳定性高，定期进行活性碳处理即可维持长期性能稳定
Low by-product, dry film anti contamination,highly stable bath and long-time stable performance realized by regular activated carbon treatment.
3.适用于闪镀和无需闪镀流程
Applicable to flash and no flash process.
4. 各添加剂均可CVS分析
Additive agents can be analyzed by CVS.
