Product Center产品中心





孔径(Blind hole diameter):60um

介质厚度(Dielectric thickness):68um

电镀厚度(Copper surface  thickness):17um

电流密度(Current density):2.5ASD


孔径(Blind hole diameter):86um

介质厚度(Dielectric thickness):210um

电镀厚度(Copper surface  thickness):20um

电流密度(Current density):2.5ASD

SBF-530系列优势(SBF-530 series advantages):


Copper etching is unnecessary due to thin copper surface plated(17 to 22um).


High current density will shorten plating time and improve productivity.

3. 副产物低,药水稳定性高,定期进行活性碳处理即可维持长期性能稳定

Low by-product, highly stable bath and long-time stable performance realized by regular activated carbon treatment.

4. 适用于闪镀和无需闪镀流程。

Applicable to flash and no flash process.


Additive agents can be analyzed by CVS.

电 话
地 图
分 享
邮 件