SBF-500 series

Hole depth:80um

Copper surface  thickness:15um

Current density:2.5ASD


Blind hole diameter:75μm 

 Blind hole diameter:100μm




A/R: 4:1       TP: 85%


A/R: 5:1       TP: 70%




SBF-500 series advantages:

1.Copper etching is unnecessary due to thin copper surface plated(10 to 15um).

2.High current density will shorten plating time and improve productivity.

3. Low by-product, highly stable bath and long-time stable performance realized by regular activated carbon treatment.

4. Applicable to flash and no flash process.

5.Additive agents can be analyzed by CVS.

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