SBF-500 series
Hole depth：80um
Copper surface thickness：15um
Current density：2.5ASD
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Blind hole diameter：75μm |
Blind hole diameter：100μm |
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A/R: 4:1 TP: 85% |
A/R: 5:1 TP: 70% |
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SBF-500 series advantages:
1.Copper etching is unnecessary due to thin copper surface plated(10 to 15um).
2.High current density will shorten plating time and improve productivity.
3. Low by-product, highly stable bath and long-time stable performance realized by regular activated carbon treatment.
4. Applicable to flash and no flash process.
5.Additive agents can be analyzed by CVS.
