
SBF-510 series
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Blind hole diameter:65um Copper surface thickness:8um |
Hole depth:25um Current density:1.5ASD |
SBF-510 series advantages:
1.Super thin copper plated, blind hole can be filled well when copper thickness plated from 5um to 10um.
2.Low by-product, dry film anti contamination,highly stable bath and long-time stable performance realized by regular activated carbon treatment.
3.Applicable to flash and no flash process.
4.Additive agents can be analyzed by CVS.