SBF-510 series




Blind hole diameter:65um

Copper surface  thickness:8um


Hole depth:25um

Current density:1.5ASD

SBF-510 series advantages:

1.Super thin copper plated, blind hole can be filled well when copper thickness plated from 5um to 10um.

2.Low by-product, dry film anti contamination,highly stable bath and long-time stable performance realized by regular activated carbon treatment.

3.Applicable to flash and no flash process.

4.Additive agents can be analyzed by CVS.

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