SBF-530 series
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Blind hole diameter：60um Dielectric thickness：68um Copper surface thickness：17um Current density：2.5ASD |
Blind hole diameter：86um Dielectric thickness：210um Copper surface thickness：20um Current density：2.5ASD |
1.Copper etching is unnecessary due to thin copper surface plated(17 to 22um).
2.High current density will shorten plating time and improve productivity.
3.Low by-product, highly stable bath and long-time stable performance realized by regular activated carbon treatment.
4.Applicable to flash and no flash process.
5.Additive agents can be analyzed by CVS.
