SBF-530 series




Blind hole diameter:60um

Dielectric thickness:68um

Copper surface  thickness:17um

Current density:2.5ASD


Blind hole diameter:86um

Dielectric thickness:210um

Copper surface  thickness:20um

Current density:2.5ASD

SBF-530 series advantages):

1.Copper etching is unnecessary due to thin copper surface plated(17 to 22um).

2.High current density will shorten plating time and improve productivity.

3.Low by-product, highly stable bath and long-time stable performance realized by regular activated carbon treatment.

4.Applicable to flash and no flash process.

5.Additive agents can be analyzed by CVS.

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